#Neuratron photoscore ultimate 7 windows crack keygen#
In the 3D semiconductor device, since the distance between the active/passive layers can be minimized, the degree of integration and the miniaturization of the semiconductor device can be increased.įIG. Recently, a three-dimensional (3D) semiconductor device in which an active/passive layer is integrated into a horizontal-direction direction within a chip as well as in a vertical direction has been developed. However, the active/passive layers are stacked two-dimensionally on a semiconductor substrate in a semiconductor chip structure. In such a semiconductor device, the active/passive layers are electrically connected through the metal interconnection to form a semiconductor chip. An insulating layer is used to insulate the interconnection layers from each other.
Active/passive layers are electrically connected through a metal interconnection. In general, semiconductor devices include a semiconductor substrate on which active/passive layers and electrodes are formed, and a plurality of interconnection layers that connect the electrodes to external terminals. The disclosure relates to a semiconductor device and a method of fabricating the same, and more particularly, to a three-dimensional semiconductor device and a method of fabricating the same. Neuratron PhotoScore Ultimate 7.0.2 (Patch MPT).
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